Module Development Engineer (Ph.D.) - Intel Foundry

About the role

Job Details:

Job Description:

About the Role

Intel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of Intel architecture.

As a Module Development Engineer, you will drive the development, optimization, characterization, and high-volume manufacturing (HVM) transfer of leading-edge semiconductor processes.

- Patterning & Removal: Lithography, Overlay, Wet Etch, Dry/Plasma Etch, Chemical Mechanical Planarization (CMP).

- Thin Films & Doping: Epitaxy (EPI), Thin-Film Deposition (ALD/CVD/PVD), Diffusion, Ion Implantation, Metals/Metallization, Dielectrics.

- Metrology, Yield & Integration: In-line Metrology, FEOL/BEOL Process Integration, Defect Reduction, Yield Analysis, Electrical Characterization.

Key Responsibilities ("What You Will Do")

- Process & Hardware Engineering: Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.

- Process Control & Data Analytics: Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability, mitigate defects, and drive yield enhancement.

- Cross-Functional & Vendor Collaboration: Partner with external tool/material suppliers and internal integration teams to co-develop cutting-edge equipment and process methodologies.

- HVM Technology Transfer: Resolve equipment, process, and yield excursion root causes to ensure smooth, robust technology transfer from development into high-volume manufacturing.

- Documentation & Technical Reporting: Document experimental findings, operating procedures, and technical recommendations through engineering reports and presentations.

Qualifications:

Candidates must meet the following criteria (relevant experience may be gained through academic coursework, laboratory research, thesis work, internships, post doc, or publications):

Minimum Qualifications

- Education: Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or a related STEM field (expected completion prior to start date).

- Hands-on Experience: 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology, including one or more of the following: lithography (Litho)/overlay, epitaxy (EPI), wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization.

Preferred Qualifications

- Environment & Tooling: 6+ months in a cleanroom or semiconductor research lab working directly with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry).