R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

About the role

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Job Description:

Development of device testing at wafer level, die level and module level

More specific duties include the following:

- Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.

- Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.

- Design of test application PCBs, test sockets, probe cards.

- Handover of test solutions to the production site or to external test houses.

- Full characterization of the devices over corner conditions, according to specification.

- Evaluation, analysis and reporting of characterization results and production test results along with creation of respective reports.

- Close cooperation with IC-designers, product-designers and project leaders throughout the entire project phase.

- Optimization of productive test packages (wafer level or final module test) based on the analysis of characterization and test data in order to achieve cost-efficient test solutions.

Required qualifications:

- Master’s Degree or PhD in Electrical Engineering, Physics or equivalent discipline with focus on semiconductor devices and/or electrical/optical testing and measurement technology.

- 3+ years of experience in semiconductor testing.

Desired skills and expertise:

- Deep technical expertise in the area of testing and measurement technology as well as data analysis techniques.

- Experience with discrete test/measurement equipment (oscilloscope, SMU, spectrum analyzer, etc.). Ideally also familiar with ATE equipment from well-known manufacturers (e.g. Teradyne, Advantest, LTX, etc.).

- Good knowledge of wafer probers and different probe card technologies.

- Profound expertise of structured programming using common languages, e.g. Python, C++, LabVIEW, NI TestStand, Python, C#, Java, MATLAB or similar software and maybe special ATE programming languages.

- Experience using AI tools to support the execution of the tasks described above.

- Good technical background in semiconductors.

- Both a self-contained, accurate approach to work and a broad interest in interdisciplinary work at the interface of electronics, optics, fiber technology and communication systems.

- Project experience and ability to integrate into teams across different functions and locations.